The numerical manifold method for crack modeling of two-dimensional functionally graded materials under thermal shocks (vol 208, pg 90, 2019)

被引：1
|
作者：
Zhang, H. H. [1 ]
Liu, S. M. [1 ]
Han, S. Y. [1 ]
Fan, L. F. [2 ]
机构：
[1] Nanchang Hangkong Univ, Sch Civil Engn & Architecture, Nanchang 330063, Jiangxi, Peoples R China
[2] Beijing Univ Technol, Coll Architecture & Civil Engn, Beijing 100084, Peoples R China
来源：
ENGINEERING FRACTURE MECHANICS | 2020年 / 230卷
关键词：
D O I：
10.1016/j.engfracmech.2020.106975
中图分类号：
O3 [力学];
学科分类号：
08 ; 0801 ;
摘要：
引用
收藏
页数：2
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