The numerical manifold method for crack modeling of two-dimensional functionally graded materials under thermal shocks (vol 208, pg 90, 2019)

被引:1
|
作者
Zhang, H. H. [1 ]
Liu, S. M. [1 ]
Han, S. Y. [1 ]
Fan, L. F. [2 ]
机构
[1] Nanchang Hangkong Univ, Sch Civil Engn & Architecture, Nanchang 330063, Jiangxi, Peoples R China
[2] Beijing Univ Technol, Coll Architecture & Civil Engn, Beijing 100084, Peoples R China
关键词
D O I
10.1016/j.engfracmech.2020.106975
中图分类号
O3 [力学];
学科分类号
08 ; 0801 ;
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页数:2
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