Metrology for emerging research materials and devices

被引:0
|
作者
Garner, C. Michael [1 ]
Herr, Dan [2 ]
机构
[1] Intel Corp, SCI 05,2200 Miss Coll Blvd, Santa Clara, CA 95054 USA
[2] Semionductor Res Corp, Durham, England
关键词
devices; nanomaterials; metrology; interfaces; spin; molecular; charge;
D O I
暂无
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The International Technology Roadmap for Semiconductors (ITRS) [1] identifies a number of potentially enabling device and materials technologies to extend and compliment CMOS. These emerging memory and logic devices employ alternate "states" including 1D charge state, molecular state, polarization, material phase, and spin. The improvement of these materials and devices depends on utilizing existing and new metrology methods to characterize their structure, composition and emerging critical properties at the nanometer scale. The metrology required to characterize nanomaterials, interfaces, and device structures will include existing structural metrology, such as TEM, SEM, and others, as well as metrology to characterize new "state" properties of the materials. The characterization of properties and correlations to nanostructure and composition are critical for these new devices and materials. Characterizing the properties of emerging logic technologies will be very difticult, as an applied stimulus is required to probe dynamic state changes. In many cases, it will be important simultaneously to measure the spatial variation of multiple state properties, such as charge and spin, as a function of time at high frequencies to develop an understanding of the interactions occurring in the materials and at interfaces. Furthermore, the challenge of characterizing interface structure/composition and "state" interactions likely will increase with device scaling. New metrology capabilities are needed to study the static and dynamic properties of potential alternate "state" materials and devices at small dimensions.
引用
收藏
页码:34 / +
页数:3
相关论文
共 50 条
  • [1] Metrology challenges for emerging research devices and materials
    Garner, C. Michael
    Vogel, Eric M.
    IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2006, 19 (04) : 397 - 403
  • [2] Metrology and Characterization Challenges for Emerging Research Materials and Devices
    Garner, C. Michael
    Herr, Dan
    Obeng, Yaw
    FRONTIERS OF CHARACTERIZATION AND METROLOGY FOR NANOELECTRONICS: 2011, 2011, 1395
  • [3] Metrology for emerging devices and materials
    Vogel, EM
    Characterization and Metrology for ULSI Technology 2005, 2005, 788 : 650 - 655
  • [4] Metrology for Emerging Materials, Devices, and Structures: The Example of Graphene
    Diebold, Alain C.
    FRONTIERS OF CHARACTERIZATION AND METROLOGY FOR NANOELECTRONICS: 2009, 2009, 1173 : 3 - 11
  • [5] Infrared metrology for spintronic materials and devices
    Vopsaroiu, M.
    Stanton, T.
    Thomas, O.
    Cain, M.
    Thompson, S. M.
    MEASUREMENT SCIENCE AND TECHNOLOGY, 2009, 20 (04)
  • [6] Technology and metrology of new electronic materials and devices
    Vogel, Eric M.
    NATURE NANOTECHNOLOGY, 2007, 2 (01) : 25 - 32
  • [7] Metrology for Advanced Transistor and Memristor Devices and Materials
    Diebold, Alain C.
    Cady, Nathaniel C.
    METROLOGY, INSPECTION, AND PROCESS CONTROL FOR MICROLITHOGRAPHY XXXIV, 2020, 11325
  • [8] Technology and metrology of new electronic materials and devices
    Eric Vogel
    Nature Nanotechnology, 2007, 2 : 25 - 32
  • [9] Nanoscale imaging and metrology of devices and innovative materials
    Spinella, Corrado
    Raineri, Vito
    Vandervorst, Wilfried
    Ciappa, Mauro
    MICROELECTRONIC ENGINEERING, 2007, 84 (03) : 375 - 375
  • [10] Emerging Photovoltaic Materials and Devices
    Zhao, Kui
    Yang, Zhou
    Liu, Shengzhong
    ADVANCED FUNCTIONAL MATERIALS, 2019, 29 (47)