Investigation of traps in AlGaN/GaN HEMTs on silicon substrate

被引:3
|
作者
Wolter, M [1 ]
Marso, M [1 ]
Javorka, P [1 ]
Bernát, J [1 ]
Carius, R [1 ]
Lüth, H [1 ]
Kordos, P [1 ]
机构
[1] Forschungszentrum Julich, Inst Thin Films & Interfaces1, D-52425 Julich, Germany
关键词
D O I
10.1002/pssc.200303535
中图分类号
O7 [晶体学];
学科分类号
0702 ; 070205 ; 0703 ; 080501 ;
摘要
Deep levels in AlGaN/GaN heterostructures are known to be responsible for trapping processes like current collapse or dispersion. In order to investigate these processes we performed different measurements on HEMTs fabricated with heterostructures grown on silicon substrate. First by photoionization spectroscopy we found three different traps with activation energies of about 2.1 eV, 2.9 eV and 3.2 eV. Secondly, the temperature dependent relaxation of the drain current was investigated by the backgating current deep level transient spectroscopy (DLTS) method. Hereby we detected majority and minority carrier traps in the GaN buffer at the energies E-V + 0.41 eV and E-C - 0.55 eV, respectively. The latter energy can be attributed to the well known "E2" level in GaN. (C) 2003 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
引用
收藏
页码:2360 / 2363
页数:4
相关论文
共 50 条
  • [21] Microwave noise characteristics of AlGaN/GaN HEMTs on high-resistivity silicon substrate
    Liu, Z. H.
    Arulkumaran, S.
    Ng, G. I.
    Cheong, W. C.
    Zeng, R.
    Bu, J.
    Wang, H.
    Radhakrishnan, K.
    Tan, C. H.
    2005 IEEE INTERNATIONAL WORKSHOP ON RADIO-FREQUENCY INTEGRATION TECHNOLOGY, PROCEEDINGS: INTEGRATED CIRCUITS FOR WIDEBAND COMMUNICATION AND WIRELESS SENSOR NETWORKS, 2005, : 127 - 130
  • [22] Performance of Unstuck Γ Gate AlGaN/GaN HEMTs on (001) Silicon Substrate at 10 GHz
    Gerbedoen, J-C.
    Soltani, A.
    Defrance, N.
    Rousseau, M.
    Gaquiere, C.
    De Jaeger, J-C.
    Joblot, S.
    Cordier, Y.
    2008 EUROPEAN MICROWAVE INTEGRATED CIRCUITS CONFERENCE (EUMIC), 2008, : 330 - +
  • [23] Current Collapse Suppression in AlGaN/GaN HEMTs Using Silicon Substrate Removal Technique
    Chen, Yueh-Ting
    Huang, JianJang
    2019 IEEE WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS IN ASIA (WIPDA ASIA 2019), 2019,
  • [24] Theoretical Investigation of Trigate AlGaN/GaN HEMTs
    Alsharef, Mohamed A.
    Granzner, Ralf
    Schwierz, Frank
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2013, 60 (10) : 3335 - 3341
  • [25] AlGaN/GaN HEMTs on epitaxies grown on composite substrate
    Hoel, V.
    Boulay, S.
    Gerard, H.
    Rabaland, V.
    Delos, E.
    De Jaeger, J. C.
    Di-Forte-Poisson, M. A.
    Brylinski, C.
    Lahreche, H.
    Langer, R.
    Bove, P.
    2007 EUROPEAN MICROWAVE INTEGRATED CIRCUITS CONFERENCE, VOLS 1 AND 2, 2007, : 480 - +
  • [26] Simulation investigation of effects of substrate and thermal boundary resistance on performances of AlGaN/GaN HEMTs
    Wang, Kang
    Hu, Wenbo
    Wu, Shengli
    Wang, Hongxing
    Padhiar, Muhammad Amin
    Ji, Yongqiang
    PHYSICA SCRIPTA, 2024, 99 (06)
  • [27] 2D study of AlGaN/AlN/GaN/AlGaN HEMTs' response to traps
    Hezabra, A.
    Abdeslam, N. A.
    Sengouga, N.
    Yagoub, M. C. E.
    JOURNAL OF SEMICONDUCTORS, 2019, 40 (02)
  • [28] 2D study of AlGaN/AlN/GaN/AlGaN HEMTs' response to traps
    A.Hezabra
    N.A.Abdeslam
    N.Sengouga
    M.C.E.Yagoub
    Journal of Semiconductors, 2019, (02) : 43 - 48
  • [29] Growth of AlGaN/GaN HEMTs on Silicon Substrates by MBE
    Semond, Fabrice
    Cordier, Yvon
    Natali, Franck
    Le Louarn, Arnaud
    Vezian, Stephane
    Joblot, Sylvain
    Chenot, Sebastien
    Baron, Nicolas
    Frayssinet, Eric
    Moreno, Jean-Christophe
    Massies, Jean
    ADVANCES IN GAN, GAAS, SIC AND RELATED ALLOYS ON SILICON SUBSTRATES, 2008, 1068 : 51 - 56
  • [30] Vertical Current Transport in AlGaN/GaN HEMTs on Silicon: Experimental Investigation and Analytical Model
    Remesh, Nayana
    Mohan, Nagaboopathy
    Kumar, Sandeep
    Prabhu, Shreesha
    Guiney, Ivor
    Humphreys, Colin J.
    Raghavan, Srinivasan
    Muralidharan, Rangarajan
    Nath, Digbijoy N.
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2019, 66 (01) : 613 - 618