Evaluation of an experimental glass frit free thick film metallization for AlN-ceramics

被引：0

作者：

Smetana, W

Reicher, R

机构：

[1] Vienna Tech Univ, Inst Werkstoffe Elektrotech, A-1040 Vienna, Austria

[2] Vienna Tech Univ, Inst Chem Phys, A-1040 Vienna, Austria

来源：

INFORMACIJE MIDEM-JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS | 1997年 / 27卷 / 04期

关键词：

semiconductors; semiconductor devices; power electronics; AlN ceramics; aluminum nitrides ceramics; thick film metallization; metallization of AlN ceramic; electrical conductive pastes; metallization pastes; thick film pastes; glass frit free metallization pastes; TiCuAg thick film metallization; SEM analysis; Scanning Electron Microscope Analysis; surface analysis; evaluation of experiments;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A glass frit free thick film paste has been especially developed for metallization of AIN ceramic. The metallized ceramic has been characterized theoretically as well as by experiment. A numerical analysis of temperature distribution induced by a continuous and pulsed mode operating heat source has been conducted by means of a finite element program. With regard to evaluate the adhesion properties of the metal film the tensile strength of the metallization has been determined.

引用

页码：260 / 266

页数：7

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