Special issue on materials and processes for submicron technologies-III - Foreword

被引：0

作者：

Kang, SH ^{[1
]}

Ravindra, NM

机构：

[1] Agere Syst, IC Device Technol, Allentown, PA USA

[2] New Jersey Inst Technol, Dept Phys, Newark, NJ 07102 USA

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2003年 / 32卷 / 10期

关键词：

D O I：

10.1007/s11664-003-0078-2

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：981 / 981

页数：1

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