Recrystallization behaviour during annealing of cold-rolled Cu-5Fe-2Sn alloy

被引：10

作者：

Zhang, Jun ting ^{[1
]}

Lin, Jinbao ^{[1
]}

Wang, Qianqian ^{[1
]}

Du, Xiu li ^{[1
]}

Wang, You hong ^{[2
]}

机构：

[1] Taiyuan Univ Sci & Technol, Sch Appl Sci, Taiyuan 030024, Peoples R China

[2] Taiyuan Univ Sci & Technol, Inst Mat Sci & Technol, Taiyuan, Peoples R China

来源：

MATERIALS SCIENCE AND TECHNOLOGY | 2020年 / 36卷 / 11期

关键词：

Cu-5Fe-2Sn alloy; recrystallization kinetics; electrical conductivity; strength; annealing; CU-FE-AG; DYNAMIC RECRYSTALLIZATION; PHASE-TRANSFORMATION; AGING BEHAVIOR; HIGH-CONDUCTIVITY; MICROSTRUCTURE; NI; STRENGTH; PRECIPITATION; MECHANISM;

D O I：

10.1080/02670836.2020.1759275

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The recrystallization behaviour during annealing of cold-rolled Cu-5Fe-2Sn alloy was clarified in this paper. The effects of annealing temperature and time on the microstructure and properties of the Cu-5Fe-2Sn alloy were investigated. The equations of electrical conductivity and recrystallization kinetics during annealing were obtained with Martition's rule and Avrami empirical formula. The variations of recrystallization volume fraction and the growth of recrystallization grain for Cu-5Fe-2Sn alloy after 40% cold rolling were discussed. The calculated conductivity and volume fraction of recrystallization have a good match with experimental results. The variations of the properties of annealed Cu-5Fe-2Sn alloy are attributed to the growth rate of recrystallization phase and the size of recrystallization grains.

引用

页码：1162 / 1168

页数：7

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