High-power surface-mount package holds RF ICs

被引：0
|
作者：
Chin, S
机构：
来源：
ELECTRONIC PRODUCTS MAGAZINE | 1996年 / 39卷 / 06期
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D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
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页码：21 / 22
页数：2
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