Mechanisms of particle removal during brush scrubber cleaning

被引：0
|
作者：
Xu, K [1 ]
Vos, R [1 ]
Vereecke, G [1 ]
Mertens, PW [1 ]
Heyns, MM [1 ]
Vinckier, C [1 ]
Fransaer, J [1 ]
机构：
[1] IMEC, B-3001 Heverlee, Belgium
来源：
CLEANING TECHNOLOGY IN SEMICONDUCTOR DEVICE MANUFACTURING VIII | 2004年 / 2003卷 / 26期
关键词：
D O I：
暂无
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
The article focuses on the mechanisms of particle removal during brush scrubber cleaning for nano-sized slurry particles. The removal of Clariant SiO2 slurry particles with average size of 34nm from nitride substrates is investigated. To measure such nano-sized particles on wafers, the haze signal is used. After a scrubber clean, the uniformity of the particle radial surface concentration on a wafer is checked. The processing time effect on the particle removal is analysed afterwards. Based on rolling and lifting removal mechanisms, some initial models are developed to describe the particle radial surface concentration after scrubbing. By doing so, the removal mechanisms of scrubbing under varied scrubbing conditions are determined. Finally, some experimental evidences on the particle removal mechanisms are shown in this study.
引用
收藏
页码：137 / 144
页数：8
相关论文
共 50 条
  • [41] Cleaning kinetics and related mechanisms of Bacillus cereus spore removal during an alkaline cleaning of a tubular ceramic microfiltration membrane
    Blanpain-Avet, P.
    Faille, C.
    Benezech, T.
    DESALINATION AND WATER TREATMENT, 2009, 5 (1-3) : 235 - 251
  • [42] Cleaning mechanisms during post chemical mechanical polishing (CMP) using particle removal of surfactants via a citric acid-based solution
    Du, Haoyu
    Liu, Renhao
    Tan, Baimei
    Wang, Fangyuan
    Wang, Xiaolong
    Han, Xinyu
    Zhao, Xinyu
    Zhao, Jiadong
    COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS, 2024, 697
  • [43] Particle removal efficiency of gravitational wet scrubber considering diffusion, interception, and impaction
    Kim, HT
    Jung, CH
    Oh, SN
    Lee, KW
    ENVIRONMENTAL ENGINEERING SCIENCE, 2001, 18 (02) : 125 - 136
  • [44] Effect of the space charge precipitation on wet scrubber fine particle removal efficiency
    Laitinen, A.
    Hautanen, J.
    Keskinen, J.
    Journal of Aerosol Science, 1997, 28 (SUPPL. 1)
  • [45] Liquid infiltration and particle removal for cleaning in deep trenches
    Ota, K
    Chiarello, RP
    Helms, CR
    CLEANING TECHNOLOGY IN SEMICONDUCTOR DEVICE MANUFACTURING, 2000, 99 (36): : 477 - 484
  • [46] Particle removal from semiconductor wafers by megasonic cleaning
    Kuehn, T.H.
    Kittelson, D.B.
    Wu, Y.
    Gouk, R.
    Pergamon Press Inc, Tarrytown (27):
  • [47] Role of Penetrating Agent on Colloidal Silica Particle Removal during Post Cu CMP Cleaning
    Yang, Liu
    Liu, Yuling
    Wang, Chenwei
    Tan, Baimei
    Gao, Baohong
    Han, Chunyu
    Liu, Yilin
    Tang, Xinliang
    ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2018, 7 (08) : P380 - P384
  • [48] Yield enhancement through understanding the particle adhesion and removal mechanisms in CMP and post-CMP cleaning processes
    Taylor, J
    Busnaina, A
    2000 IEEE/SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE AND WORKSHOP, 2000, : 14 - 17
  • [49] Structural and compositional changes during UHT fouling removal-Possible mechanisms of the cleaning process
    Hagsten, Carin
    Altskar, Annika
    Gustafsson, Stefan
    Loren, Niklas
    Tragardh, Christian
    Innings, Fredrik
    Hamberg, Lars
    Paulsson, Marie
    Nylander, Tommy
    FOOD STRUCTURE-NETHERLANDS, 2019, 21
  • [50] Determination of cleaning mechanisms by measuring particle size distributions
    Gottschalk, Nathalie
    Reuter, Lisa Selina
    Zindler, Svenja
    Foeste, Henning
    Augustin, Wolfgang
    Scholl, Stephan
    FOOD AND BIOPRODUCTS PROCESSING, 2019, 113 : 77 - 85
12345