Thermo-mechanical modeling of a thermo-optically actuated silicon membrane

被引:0
|
作者
Duarte, JE [1 ]
Morales, FHF [1 ]
Sieiro, J [1 ]
Leseduarte, S [1 ]
Moreno, M [1 ]
机构
[1] Univ Pedag & Tecnol Colombia, Boyaca, Colombia
关键词
D O I
暂无
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
In this paper we present the numerical analysis of a thermo-optically actuated silicon membrane using the ANSYS program. The power is conveyed into the system by means of a 10mW laser beam, which heats and expands the air enclosed in the actuating cavity. The frecuency at which this beam is triggered has been chosen to be 100 Hz and the calculated Bow rate is 1.81 mu l/min. To the best of our knowledge this is the first work that numerically analyzes the performance of a thermo-optically actuated silicon micropump based on the expansion of air.
引用
收藏
页码:155 / 157
页数:3
相关论文
共 50 条
  • [41] Thermo-mechanical coupling in constitutive modeling of dissipative materials
    Egner, Wladyslaw
    Egner, Halina
    INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, 2016, 91 : 78 - 88
  • [42] Thermo-optically active planar polymeric components for telecommunication applications
    Eldada, L
    Beeson, K
    Pant, D
    Blomquist, R
    Shacklette, LW
    McFarland, MJ
    ORGANIC PHOTONIC MATERIALS AND DEVICES II, 2000, 3939 : 69 - 78
  • [43] Thermo-mechanical and fracture properties in single-crystal silicon
    Masolin, Alex
    Bouchard, Pierre-Olivier
    Martini, Roberto
    Bernacki, Marc
    JOURNAL OF MATERIALS SCIENCE, 2013, 48 (03) : 979 - 988
  • [44] Thermo-mechanical and fracture properties in single-crystal silicon
    Alex Masolin
    Pierre-Olivier Bouchard
    Roberto Martini
    Marc Bernacki
    Journal of Materials Science, 2013, 48 : 979 - 988
  • [45] Thermo-mechanical stresses in laminated polymer films on silicon substrates
    Kim, JS
    Paik, KW
    Oh, SH
    Seo, HS
    ELECTRONIC PACKAGING MATERIALS SCIENCE X, 1998, 515 : 147 - 152
  • [46] Experimental Techniques for Thermo-mechanical Design in Silicon Validation Platforms
    Mohammed, Rahima K.
    Xia, Yi
    Pang, Ying-Feng
    Prabhugoud, Mohanraj
    Sahan, Ridvan A.
    TWENTY-FIFTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, 2009, : 164 - 171
  • [47] Thermo-mechanical stresses in laminated polymer films on silicon substrates
    Kim, JS
    Paik, KW
    Oh, SH
    Seo, HS
    1998 INTERNATIONAL CONFERENCE ON MULTICHIP MODULES AND HIGH DENSITY PACKAGING, PROCEEDINGS, 1998, : 449 - 453
  • [48] Coupled Thermo-Mechanical Analysis of Mass Reduced Silicon Micromirrors
    Hall, Harris J.
    Schmidt, Jason
    Starman, LaVern
    2018 19TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME), 2018,
  • [49] Simulation of thermo-mechanical effect in bulk-silicon FinFETs
    Burenkov, Alex
    Lorenz, Juergen
    MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2016, 42 : 242 - 246
  • [50] Thermo-mechanical reliability of microcomponents
    Dudek, R
    Schubert, A
    Michel, B
    MICRO MATERIALS, PROCEEDINGS, 2000, : 206 - 213