Acceleration effect of electroless nickel deposition by thiourea

被引：0
|
作者：
Han, KP
Fang, JL
机构：
来源：
INTERNATIONAL JOURNAL OF CHEMICAL KINETICS | 1996年 / 28卷 / 04期
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中图分类号：
O64 [物理化学（理论化学）、化学物理学];
学科分类号：
070304 ; 081704 ;
摘要：
It was found that the presence of thiourea can increase the electroless nickel (EN) deposition rate and hydrogen evolution simultaneously influences of thiourea on the electrochemical behaviors of EN solution and activation energy of EN reaction were studied. The composition of the deposit was also determined by means of X-ray photoelectron spectroscopy (XPS) and Auger electron spectroscopy (AES). The results show that thiourea accelerates the nickel deposition due to interference in the anodic process of EN plating. (C) 1996 John Wiley & Sons, Inc.
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页码：259 / 264
页数：6
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