Acceleration effect of electroless nickel deposition by thiourea

It was found that the presence of thiourea can increase the electroless nickel (EN) deposition rate and hydrogen evolution simultaneously influences of thiourea on the electrochemical behaviors of EN solution and activation energy of EN reaction were studied. The composition of the deposit was also determined by means of X-ray photoelectron spectroscopy (XPS) and Auger electron spectroscopy (AES). The results show that thiourea accelerates the nickel deposition due to interference in the anodic process of EN plating. (C) 1996 John Wiley & Sons, Inc.