In-line wafer inspection data warehouse for automated defect limited yield analysis

被引：6
|
作者：
Iwata, H [1 ]
Ono, M [1 ]
Konishi, J [1 ]
Isogai, S [1 ]
Furutani, T [1 ]
机构：
[1] Hitachi Ltd, Integrated Mfg Proc Dept, Prod Engn Res Lab, Totsuka Ku, Yokohama, Kanagawa 2440817, Japan
来源：
2000 IEEE/SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE AND WORKSHOP | 2000年
关键词：
yield enhancement; in-line inspection; Kill Ratio; Intelligent Data Analysis; Data Warehouse;
D O I：
10.1109/ASMC.2000.902570
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
A data warehouse approach for the automation of process zone-by-zone defect limited yield analysis is presented in this paper. The system employs pre-calculation of adder defects extraction and clustered defects recognition, a newly developed wafer-wise defect record structure, and a graphical user interface purpose-designed for data selection navigation. Analysis time can be reduced to less than 1% of that of benchmarked conventional procedures.
引用
收藏
页码：124 / 129
页数：6
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