Temperature dependence of electrical resistivity of isotropic conductive adhesive composed of an epoxy-based binder

被引：0
|
作者：
Inoue, Masahiro [1 ]
Muta, Hiroaki [2 ]
Yamanaka, Shinsuke [2 ]
Suganuma, Katsuaki [1 ]
机构：
[1] Osaka Univ, Inst Sci & Ind Res, 8-1 Mihogaoka, Osaka 5670047, Japan
[2] Osaka Univ, Grad Sch Engn, Div Sustainable Energy & Environm, Osaka 5670047, Japan
来源：
HDP'07: PROCEEDINGS OF THE 2007 INTERNATIONAL SYMPOSIUM ON HIGH DENSITY PACKAGING AND MICROSYSTEM INTEGRATION | 2007年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The temperature dependence of electrical resistivity for a practical isotropic conductive adhesive (ICA) composed of an epoxy-based binder was investigated. The ICA specimens were cured and post-annealed at various conditions in order to clarify the effect of curing state of adhesive binder on the electrical resistivity. The electrical resistivity at ambient temperature tends to decrease with increasing curing temperature even if they exhibit full conversion. The annealing effect that results in deviation from linearity in the temperature dependence of resistivity can be induced during heating process for resistivity measurement. These specimens exhibited similar values for temperature coefficient of resistivity (TCR) regardless of curing and post-annealing conditions. However, the thermal history of the specimens significantly influences the values of electrical resistivity.
引用
收藏
页码：149 / +
页数：2
相关论文
共 50 条
  • [41] Effect of several surfactants for enhancing electrical conductivity development through silver fillers in an epoxy-based binder
    Nakazawa, Shiho
    Inoue, Masahiro
    2019 IEEE CPMT SYMPOSIUM JAPAN (ICSJ), 2019, : 157 - 161
  • [42] Electrical Resistance and Microstructural Changes of Silver-Epoxy Isotropic Conductive Adhesive Joints Under High Humidity and Heat
    Kim, Sun-Sik
    Kim, Keun-Soo
    Lee, Kiju
    Kim, Seongjun
    Suganuma, Katsuaki
    Tanaka, Hirokazu
    JOURNAL OF ELECTRONIC MATERIALS, 2011, 40 (02) : 232 - 238
  • [43] A review of research advances in epoxy-based nanocomposites as adhesive materials
    Jojibabu, Panta
    Zhang, Y. X.
    Prusty, B. Gangadhara
    INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 2020, 96
  • [44] Study of Electrical and Thermal Conduction Mechanisms in Novel Isotropic Conductive Adhesive
    Kristiansen, Helge
    Helland, Susanne
    Pettersen, Sigurd
    Al-Alam, Patricia
    2016 IEEE CPMT SYMPOSIUM JAPAN (ICSJ), 2016, : 43 - 46
  • [45] The Effect of Nano Fillers in Electrical and Mechanical Properties of Isotropic Conductive Adhesive
    Chew, C. S.
    Durairaj, R.
    Hwang, J.
    Tan, J.
    Liang, M. S.
    Tan, C. N.
    Chen, K. P.
    2014 IEEE 36TH INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY CONFERENCE (IEMT), 2015,
  • [46] Control of Silver Micro-Flakes Sintering and Connection Properties of Epoxy-Based Conductive Adhesives by the Effectiveness of Binder Chemistry
    Fukushima, Takanori
    Inoue, Masahiro
    MATERIALS, 2025, 18 (02)
  • [47] Investigation of electrical-mechanical performance of epoxy-based nanocomposites filled with hybrid electrically conductive fillers
    Suherman, Hendra
    Dweiri, Radwan
    Mahyoedin, Yovial
    Duskiardi, Duskirdi
    MATERIALS RESEARCH EXPRESS, 2019, 6 (11)
  • [48] Experimental and numerical analysis of cyclic aging in an epoxy-based adhesive
    Moazzami, M.
    Ayatollahi, M. R.
    Akhavan-Safar, A.
    da Silva, L. F. M.
    POLYMER TESTING, 2020, 91
  • [49] Effects of hygrothennal aging on epoxy-based anisotropic conductive film
    Lin, Y. C.
    Chen, Xu
    Zhang, H. J.
    Wang, Z. P.
    MATERIALS LETTERS, 2006, 60 (24) : 2958 - 2963
  • [50] Influence of silica particles on the electrical and thermal properties of epoxy/silver based isotropic conductive adhesives
    Nam, Seungwoong
    Kim, Daeheum
    Kim, Heesuk
    Lim, Soonho
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2012, 243
12345