Production challenges of making EUV mask blanks

被引:0
|
作者
Seitz, H [1 ]
Sobel, F [1 ]
Renno, M [1 ]
Leutbecher, T [1 ]
Olschewski, N [1 ]
Reichardt, T [1 ]
Walter, R [1 ]
Becker, H [1 ]
Buttgereit, U [1 ]
Hess, G [1 ]
Knapp, K [1 ]
机构
[1] SCHOTT Lithotec AG, D-98617 Meiningen, Germany
关键词
D O I
10.1117/12.637335
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
摘要
Mask Blanks for EUV Lithography require a lot of new properties and features compared to standard Chrome-on-Glass blanks. Starting from completely new low thermal expansion substrate materials with significantly improved surface quality over multilayer coatings for EUV reflection, buffer layers, up to new absorber layers with improved dry etching and inspection properties. In addition highly sophisticated metrology is needed for further improvements and process control. New polishing and cleaning technologies, improved sputter technology and updated metrology enable us to routinely produce EUVL mask blanks meeting already many of the ITRS roadmap requirements. Our improvements on low defect EUV multilayer coatings as well as on our metrology methods will be elucidated and some aspects of this will be explained in detail. In addition a new design of EUVL absorber material with experimental results will be reported, including optical performance at inspection wavelength.
引用
收藏
页码:244 / 251
页数:8
相关论文
共 50 条
  • [31] Process development for EUV mask production
    Abe, Tsukasa
    Fujii, Akiko
    Sasaki, Shiho
    Mohri, Hiroshi
    Hayashi, Naoya
    Shoki, Tsutomu
    Yamada, Takeyuki
    Nozawa, Osamu
    Ohkubo, Ryo
    Ushida, Masao
    PHOTOMASK TECHNOLOGY 2006, PTS 1 AND 2, 2006, 6349
  • [32] Modeling methodologies and defect printability maps for buried defects in EUV mask blanks
    Lam, Michael C.
    Neureuther, Andrew R.
    EMERGING LITHOGRAPHIC TECHNOLOGIES X, PTS 1 AND 2, 2006, 6151 : U200 - U211
  • [33] A 3-D substrate and buried defect simulator for EUV mask blanks
    Lam, MC
    Neureuther, AR
    EMERGING LITHOGRAPHIC TECHNOLOGIES IX, PTS 1 AND 2, 2005, 5751 : 455 - 465
  • [34] Pattern printability for reflectance degradation of Mo/Si mask blanks in EUV lithography
    Sugawara, M
    Ito, M
    Chiba, A
    Hoshino, E
    Yamanashi, H
    Hoko, H
    Ogawa, T
    Lee, BT
    Yoneda, T
    Takahashi, M
    Nishiyama, I
    Okazaki, S
    PHOTOMASK AND NEXT-GENERATION LITHOGRAPHY MASK TECHNOLOGY IX, 2002, 4754 : 880 - 889
  • [35] RapidNano: Towards 20nm Particle Detection on EUV Mask Blanks
    Jacques van der Donck
    Peter Bussink
    Erik Fritz
    Peter van der Walle
    MRS Advances, 2016, 1 (31) : 2225 - 2236
  • [36] Sub 50 nm cleaning-induced damage in EUV mask blanks
    Rastegar, Abbas
    Eichenlaub, Sean
    Kapila, Vivek
    Kadaksham, Arun John
    Marmillion, Pat
    EMERGING LITHOGRAPHIC TECHNOLOGIES XII, PTS 1 AND 2, 2008, 6921
  • [37] Process Optimization for Performance Improvement in Mo/Si Multilayers for EUV Mask Blanks
    Rook, Katrina
    Turner, Paul
    Srinivasan, Narasimhan
    Henry, Tania
    Yamamoto, Kenji
    Lee, Meng H.
    EXTREME ULTRAVIOLET LITHOGRAPHY 2020, 2020, 11517
  • [38] Recent performance of EUV mask blanks with low thermal expansion glass substrates
    Shoki, Tsutomu
    Yamada, Takeyuki
    Shimojima, Shouji
    Shiota, Yuuki
    Tsukahara, Mitsuharu
    Koike, Kesahiro
    Shishido, Hiroaki
    Nozawa, Osamu
    Sakamoto, Toshlyuki
    Hosoya, Morio
    PHOTOMASK TECHNOLOGY 2007, PTS 1-3, 2007, 6730
  • [39] Investigating Printability of Native Defects on EUV Mask Blanks through Simulations and Experiments
    Upadhyaya, Mihir
    Jindal, Vibhu
    Herbol, Henry
    Jang, Il-Yong
    Kwon, Hyuk Joo
    Harris-Jones, Jenah
    Denbeaux, Gregory
    EXTREME ULTRAVIOLET (EUV) LITHOGRAPHY V, 2014, 9048
  • [40] Comparison of deposition techniques for Mo/Si reflective multilayers for EUV mask blanks
    Rook, Katrina
    Checco, Antonio
    Turner, Paul
    Kulkarni, Ashish A.
    Yamamoto, Kenji
    Lee, Meng H.
    INTERNATIONAL CONFERENCE ON EXTREME ULTRAVIOLET LITHOGRAPHY 2021, 2021, 11854