Low-loss Balun Design and Compact Modeling for RF/Millimeter-Wave Circuit Application

被引：0

作者：

Yao, Jian ^{[1
]}

Ye, Zuochang ^{[1
]}

Wang, Yan ^{[1
]}

机构：

[1] Tsinghua Univ, Inst Microelect, Beijing 100084, Peoples R China

来源：

2014 12TH IEEE INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT) | 2014年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

On-chip baluns are widely used in RF and Millimeter-Wave circuit. How to reduce the insertion loss is the key issue for balun designs. Meanwhile, an accurate compact model for balun is highly demanded. In this work, the Patterned Ground Shields and Parallel Metal Layer techniques are used to reduce the insertion loss of the balun. The compact model and corresponding extraction techniques are also presented. Experimental results show that the insertion loss of the fabricated balun is about 1.4db and the proposed compact model can describe it up to 30GHz accurately.

引用

页数：3

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