The evolution of microstructure and surface bonding in SiO2 aerogel film after plasma treatment using O2, N2, and H2 gases

被引：15
|
作者：
Kim, JJ [1 ]
Park, HH [1 ]
Hyun, SH [1 ]
机构：
[1] Yonsei Univ, Dept Ceram Engn, Seodaemoon Ku, Seoul 120749, South Korea
来源：
THIN SOLID FILMS | 2001年 / 384卷 / 02期
关键词：
IMD; SiO2; aerogel film; plasma treatment; VUV;
D O I：
10.1016/S0040-6090(00)01827-7
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
In this work, we investigated the effects of various gases (O-2, N-2, and H-2) plasma treatment on SiO2 aerogel films in order to strengthen the film and improve the surface chemical bonding nature of the film. The plasma treatments could reduce the density of silanol (Si-OH) and ethoxy (Si-OR) groups. The physical, chemical, and electrical properties of SiO2 aerogel film through curing with various plasma gases were evaluated. The modification of SiO2 aerogel film by plasma gas treatment was related to the physical impingement effect of ions, chemical reaction, and irradiated vacuum UV. (C) 2001 Elsevier Science B.V. All rights reserved.
引用
收藏
页码：236 / 242
页数：7
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