Study of degradations in PCB interconnections for high frequency applications

被引：0
|
作者：
Duchamp, G [1 ]
Verdier, FJM [1 ]
Levrier, B [1 ]
Marc, F [1 ]
Ousten, Y [1 ]
Danto, Y [1 ]
机构：
[1] Univ Bordeaux 1, UMR CNRS 5818, ENSEIRB, Lab IXL, F-33405 Talence, France
来源：
IPFA 2005: Proceedings of the 12th International Symposium on the Physical & Failure Analysis of Integrated Circuits | 2005年
关键词：
D O I：
10.1109/IPFA.2005.1469173
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：253 / 257
页数：5
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