The on-chip temperature compensation and temperature control research for the silicon micro-gyroscope

被引:16
|
作者
Yang, Bo [1 ,2 ]
Dai, Bo [1 ,2 ]
Liu, Xiaojun [3 ]
Xu, Lu [1 ,2 ]
Deng, Yunpeng [1 ,2 ]
Wang, Xingjun [1 ,2 ]
机构
[1] Southeast Univ, Sch Instrument Sci & Engn, Nanjing 210096, Jiangsu, Peoples R China
[2] Minist Educ, Key Lab Microinertial Instrument & Adv Nav Techno, Nanjing 210096, Jiangsu, Peoples R China
[3] Nanjing Univ Informat Sci & Technol, Sch Informat & Control, Nanjing 210044, Jiangsu, Peoples R China
基金
中国国家自然科学基金;
关键词
PERFORMANCE;
D O I
10.1007/s00542-014-2271-z
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, the on-chip temperature compensation and temperature control research for the silicon micro-gyroscope are presented. The proposed micro-gyroscope architecture which integrates an on-chip temperature sensor and a serpentine micro-heater achieves the on-chip temperature compensation and the on-chip temperature control of the micro-gyroscope. We first analyze the thermodynamic steady-state temperature distribution and transient temperature response of micro-gyroscope structure. Then we simulate the temperature response of the micro-gyroscope structure by Ansys software. The Deep Dry Silicon on Glass process and wet etching process are combined for fabrication of the integrated micro-gyroscope structure. The signal measurement and control circuit based on the FPGA platform are implemented. The temperature coefficients of zero bias and scale factor are compensated with the integrated temperature sensor. Taking advantage of the drive mode resonant frequency as the temperature sensor, a high precision on-chip temperature control of micro-gyroscope is realized simultaneously. The on-chip temperature compensation and temperature control experiment of micro-gyroscope prototype is tested. Experimental results indicate that the temperature coefficients of the scale factor and zero bias decrease by 3.95 times and 3.49 times separately by on-chip temperature compensation, which optimizes significantly the temperature characteristics of the micro-gyroscope prototype. The control accuracy of drive-mode frequency reaches to 3.57 x 10(-4) Hz (that is 0.123 ppm and the calculated temperature accuracy of 0.0067 A degrees C) from 0 to 40 A degrees C by the on-chip temperature control, which demonstrates an achievement of the precision on-chip temperature control for the micro-gyroscope.
引用
收藏
页码:1061 / 1072
页数:12
相关论文
共 50 条
  • [31] A micro-integrated Peltier heat pump for localized on-chip temperature control
    Shafai, C
    Brett, MJ
    CANADIAN JOURNAL OF PHYSICS, 1996, 74 : S139 - S142
  • [32] A micro-integrated Peltier heat pump for localized on-chip temperature control
    Shafai, C
    Brett, MJ
    1996 CANADIAN CONFERENCE ON ELECTRICAL AND COMPUTER ENGINEERING - CONFERENCE PROCEEDINGS, VOLS I AND II: THEME - GLIMPSE INTO THE 21ST CENTURY, 1996, : 88 - 91
  • [33] Research on vacuum packaging of micro-gyroscope with vacuum reflow furnace
    Liu, Wen-Ming
    Wang, Zhi-Yong
    Bao, Jian-Bin
    Wang, Xue-Fang
    Guan, Rong-Feng
    Zhu, Fu-Long
    Liu, Sheng
    Weixi Jiagong Jishu/Microfabrication Technology, 2006, (02): : 61 - 64
  • [34] Surface/bulk micromachined single-crystalline-silicon micro-gyroscope
    Lee, S
    Park, S
    Kim, J
    Lee, S
    Cho, DI
    JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2000, 9 (04) : 557 - 567
  • [35] On-chip temperature sensing and control for cell immobilization
    Lin, Yu-Ching
    Yamanishi, Yoko
    Arai, Fumihito
    2007 2ND IEEE INTERNATIONAL CONFERENCE ON NANO/MICRO ENGINEERED AND MOLECULAR SYSTEMS, VOLS 1-3, 2007, : 387 - +
  • [36] Research on temperature dependent characteristics and compensation methods for digital gyroscope
    Liu, Dachuan
    Chi, Xiaozhu
    Cui, Jian
    Lin, Longtao
    Zhao, Qiancheng
    Yang, Zhenchuan
    Yan, Guizhen
    PROCEEDINGS OF THE THIRD INTERNATIONAL CONFERENCE ON SENSING TECHNOLOGY, 2008, : 273 - 277
  • [37] Research on a dual-mass decoupled tuning fork micro-gyroscope
    Yang Bo
    Dai Bo
    Wang Xingjun
    Hu Di
    PROCEEDINGS OF 2015 IEEE 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC MEASUREMENT & INSTRUMENTS (ICEMI), VOL. 3, 2015, : 1628 - 1631
  • [38] Mechanical-Thermal Noise in Drive-Mode of a Silicon Micro-Gyroscope
    Yang, Bo
    Wang, Shourong
    Li, Hongsheng
    Zhou, Bailing
    SENSORS, 2009, 9 (05) : 3357 - 3375
  • [39] Structure error analysis and system performance test of decoupled silicon micro-gyroscope
    Yang, Bo
    Wang, Shou-Rong
    Li, Hong-Sheng
    Huang, Li-Bin
    Li, Kun-Yu
    Yin, Yong
    Nami Jishu yu Jingmi Gongcheng/Nanotechnology and Precision Engineering, 2010, 8 (06): : 545 - 552
  • [40] The Silicon Micro-Gyroscope Signal Processing Method Based on Morphological Wavelet Filter
    Zhao, Liye
    Li, Hongsheng
    Wang, Shourong
    INFORMATION-AN INTERNATIONAL INTERDISCIPLINARY JOURNAL, 2012, 15 (11A): : 4633 - 4640