The urgency of deep sub-ambient cooling for gigascale integration

被引：5
|
作者：
Naeemi, A [1 ]
Joshi, Y [1 ]
Fedorov, A [1 ]
Kohl, P [1 ]
Meindl, JD [1 ]
机构：
[1] Georgia Inst Technol, Ctr Microelect Res, Atlanta, GA 30332 USA
来源：
2005 INTERNATIONAL CONFERENCE ON INTEGRATED CIRCUIT DESIGN AND TECHNOLOGY | 2005年
关键词：
D O I：
10.1109/ICICDT.2005.1502623
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
It is shown that the performance of GSI chips will not be a function of how many transistors are integrated in a chip and how fast they can potentially switch; rather, it will be determined by how many transistors can switch per unit time. By lowering the energy per binary switching operation, liquid-air cooling can improve the performance of a power-limited chip by more than 6 generations of technology (more than 13x), significantly lower tunneling and leakage power dissipations (100x and 3.5x, respectively), and improve the performance and reliability of interconnects.
引用
收藏
页码：171 / 174
页数：4
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