Analytical models of AC inductance and quality factor for TSV-based inductor

被引：2

作者：

Yin, Xiangkun ^{[1
]}

Wang, Fengjuan ^{[2
]}

机构：

[1] Xidian Univ, Sch Microelect, Xian, Shaanxi, Peoples R China

[2] Xian Univ Technol, Sch Automat & Informat Engn, Xian 710048, Shaanxi, Peoples R China

来源：

IEICE ELECTRONICS EXPRESS | 2021年 / 18卷 / 18期

基金：

中国国家自然科学基金;

关键词：

inductor; through-silicon via (TSV); AC inductance; quality factor; THROUGH-SILICON; REGULATOR; CAPACITOR; FILTER; CORE; VIAS;

D O I：

10.1587/elex.18.20210319

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Aimed at the emerging on-chip three-dimensional through-silicon vias (TSVs)-based inductor, the formula for the DC inductance is proposed. And then, based on this formula and the equivalent circuit model analytical models of AC inductance and quality factor are proposed considering frequency effect. Finally, the TSV-based inductors are fabricated and measured. It is shown that the reported results match very well with each other.

引用

页数：3

共 46 条

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