Circuit modeling of power/ground plane structures for printed circuit boards

被引：4
|
作者：
Huang, CC [1 ]
机构：
[1] Yuan Ze Univ, Dept Commun Engn, Taoyuan 320, Taiwan
来源：
MICROWAVE AND OPTICAL TECHNOLOGY LETTERS | 2005年 / 47卷 / 01期
关键词：
printed circuit board; signal/power integrity; ground bounce; high-speed digital system; cavity model;
D O I：
10.1002/mop.21092
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
With the increase of operating frequency and circuit-component density, signal/power integrity issues due to ground bounces become more important for high-speed digital systems. This paper presents a modal analysis resulting in a multiport equivalent circuit model for the power/ground plane structures in printed circuit boards including effects of dielectric, conductor, and radiation losses. Numerical results represented in Z-parameters verified by the measured data are shown to validate the proposed approach. (c) 2005 Wiley Periodicals, Inc.
引用
收藏
页码：97 / 99
页数：3
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