The application of molecular dynamics to the study of plasma-surface interactions: CFx with silicon

被引:33
|
作者
Gou, F. [2 ]
Kleyn, A. W. [1 ,2 ]
Gleeson, M. A. [2 ]
机构
[1] Leiden Inst Chem, Gorlaeus Labs, NL-2300 RA Leiden, Netherlands
[2] Inst Plasma Phys Rijnhuizen, FOM, NL-3439 MN Nieuwegein, Netherlands
基金
欧盟地平线“2020”;
关键词
D O I
10.1080/01442350801928014
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
In this paper, we provide an overview of the use of molecular dynamics for simulations involving energetic particles (Ar, F, and CFx) interacting with silicon surfaces. The groups (including our own) that have performed this work are seeking to advance the fundamental understanding of plasma interactions at surfaces. Although this paper restricts itself largely to the systems bracketed above, the approach and general mechanisms involved are applicable to a much wider range of systems. Proper description of plasma-related systems generally requires a large number of atoms in order to correctly characterize the interactions. Consequently, the bulk of the present work, and the main focus of the text, is based on classical molecular dynamics. In MD simulations, one of the most critical considerations is the selection of the interatomic potential. For simulations involving silicon etching, the choice is typically made between the Stillinger-Weber and the Tersoff-Brenner potentials. An outline of the two potentials is given, including efforts that have been made to improve and optimize the potentials and their parameters. Subsequently, we focus on some of the practical details involved in establishing the simulation process and outline how various parameters (e.g. heat bath, relaxation time and cell size) influence the simulation results. These sections deal with the influences of the heat bath (application time, rising time), the time-step and total integration time of molecular trajectories, the relaxation of the sample (during and post-etching) and the sample size. The approach is essentially pedagogical in nature, and may be of interest to those less familiar with the techniques. To illustrate the type of results that can be produced we present a case study for 100 eV CF3+ interacting with a Si(100)-2x1 surface at different sample temperatures (100-800 K). The simulations reveal details of the change in etch rate, the F-turnover and the standing coverage of functional groups as a function of the temperature. Our primary interest is in studies with relevance for plasma-surface interactions. We discuss the general mechanisms that are most important in plasma-surface interactions and give an overview of some of the wide range of results that have been produced for various systems. The results presented illustrate that careful consideration must be given to the precise configuration of the plasma system. Numerous factors, including the chemical species, the energy and chemical mix of the incident particles and the surface composition and structure can play a crucial role in determining the net outcome of the interaction.
引用
收藏
页码:229 / 271
页数:43
相关论文
共 50 条
  • [31] Special issue on fundamentals of plasma-surface interactions
    Bogaerts, A.
    Neyts, E. C.
    Rousseau, A.
    JOURNAL OF PHYSICS D-APPLIED PHYSICS, 2014, 47 (22)
  • [32] Computer Modeling of Plasmas and Plasma-Surface Interactions
    Bogaerts, Annemie
    Bultinck, Evi
    Eckert, Maxie
    Georgieva, Violeta
    Mao, Ming
    Neyts, Erik
    Schwaederle, Laurent
    PLASMA PROCESSES AND POLYMERS, 2009, 6 (05) : 295 - 307
  • [33] Modeling of the plasma chemistry and plasma-surface interactions in reactive plasmas
    Bogaerts, Annemie
    De Bie, Christophe
    Eckert, Maxie
    Georgieva, Violeta
    Martens, Tom
    Neyts, Erik
    Tinck, Stefan
    PURE AND APPLIED CHEMISTRY, 2010, 82 (06) : 1283 - 1299
  • [34] COMPUTER SIMULATION OF THE DYNAMICS OF PLASMA-SURFACE INTERACTIONS IN VACUUM ARC CATHODE SPOTS.
    Mitterauer, J.
    Till, P.
    IEEE Transactions on Plasma Science, 1986, PS-15 (05) : 488 - 501
  • [35] Plasma-surface interactions in controlled fusion devices 15 - Proceedings of the Fifteenth International Conference on Plasma-Surface Interactions in Controlled Fusion Devices - Preface
    Ohyabu, N
    Noda, N
    Morita, K
    Takamura, S
    Tanabe, T
    JOURNAL OF NUCLEAR MATERIALS, 2003, 313 : VII - VII
  • [36] Nanoscale Transfer of Energy and Matter in Plasma-Surface Interactions
    Ostrikov, Kostya
    IEEE TRANSACTIONS ON PLASMA SCIENCE, 2011, 39 (04) : 963 - 970
  • [38] PLASMA-SURFACE INTERACTIONS IN A REVERSED-FIELD PINCH
    MATSUOKA, A
    SHIMURA, K
    KUBOTA, S
    AOTO, K
    SATO, KI
    ARIMOTO, H
    NAGATA, A
    SUGAWARA, M
    JOURNAL OF NUCLEAR MATERIALS, 1995, 220 : 654 - 657
  • [39] APPLICATION OF THE QUARTZ CRYSTAL MICROBALANCE TO THE STUDY OF PLASMA-SURFACE CHEMISTRY AND PHYSICS
    EVANS, JF
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1989, 198 : 119 - ANYL
  • [40] Study of plasma-surface interactions: Chemical dry etching and high-density plasma etching
    Oehrlein, GS
    Matsuo, PJ
    Doemling, MF
    Rueger, NR
    Kastenmeier, BEE
    Schaepkens, M
    Standaert, T
    Beulens, JJ
    PLASMA SOURCES SCIENCE & TECHNOLOGY, 1996, 5 (02): : 193 - 199