Influences of Ag addition to Sn-58Bi solder on SnBi/Cu interfacial reaction

被引：68
|
作者：
Hu, F. Q. [1 ]
Zhang, Q. K. [1 ]
Jiang, J. J. [1 ]
Song, Z. L. [1 ]
机构：
[1] Chinese Acad Sci, Ningbo Inst Mat Technol & Engn, Ningbo 315201, Zhejiang, Peoples R China
来源：
MATERIALS LETTERS | 2018年 / 214卷
关键词：
SnBi solder; Bi segregation; Ag addition; Interfacial embrittlement; Deformation and fracture; Interface; MECHANICAL-PROPERTIES; ALLOYING SUBSTRATE; TENSILE PROPERTIES; BI SEGREGATION; JOINTS; EMBRITTLEMENT; TEMPERATURE; MELT;
D O I：
10.1016/j.matlet.2017.11.127
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
In this study, the influences of Ag addition to Sn-58Bi solder on SnBi/Cu interfacial reaction and fracture behavior of the aged SnBiAg/Cu solder joints were investigated. The results reveal that the Ag element in the solder can diffuse into the Cu substrate during the soldering and aging process, forming a Cu-Ag alloy layer around the joint interface. The Bi segregation was not observed at the aged SnBiAg/Cu interface, and the embrittlement will not occur at the aged SnBiAg/Cu solder joints once the Bi segregation was restrained. (C) 2017 Elsevier B.V. All rights reserved.
引用
收藏
页码：142 / 145
页数：4
相关论文
共 50 条
  • [1] Influences of Ag and In Alloying on Microstructure and Mechanical Properties of Sn-58Bi Solder
    Yang, Jie
    Zhang, Qingke
    Song, Zhenlun
    JOURNAL OF ELECTRONIC MATERIALS, 2021, 50 (01) : 283 - 290
  • [2] Influences of Ag and In Alloying on Microstructure and Mechanical Properties of Sn-58Bi Solder
    Jie Yang
    Qingke Zhang
    Zhenlun Song
    Journal of Electronic Materials, 2021, 50 : 283 - 290
  • [3] Thermomigration and interfacial reaction in Cu/Sn-58Bi/Cu micro solder joint under temperature gradient
    Hanjie Xuebao/Transactions of the China Welding Institution, 2024, 45 (04): : 71 - 78
  • [4] Influences of Ag and In alloying on Sn-Bi eutectic solder and SnBi/Cu solder joints
    Wang, Z.
    Zhang, Q. K.
    Chen, Y. X.
    Song, Z. L.
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 30 (20) : 18524 - 18538
  • [5] Influences of Ag and In alloying on Sn-Bi eutectic solder and SnBi/Cu solder joints
    Z. Wang
    Q. K. Zhang
    Y. X. Chen
    Z. L. Song
    Journal of Materials Science: Materials in Electronics, 2019, 30 : 18524 - 18538
  • [6] Effect of Ni addition into the Cu substrate on the interfacial IMC growth during the liquid-state reaction with Sn-58Bi solder
    Hu, Xiaowu
    Qiu, Hongyu
    Jiang, Xiongxin
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 30 (02) : 1907 - 1918
  • [7] Effect of minor addition of Pb upon interfacial reactions and mechanical properties at Sn-3.0Ag-0.5Cu/Cu and Sn-58Bi/Cu solder joints
    Yen, Yee-Wen
    Chou, Weng-Ting
    Chena, Hong-Chih
    Liou, Wei-Kai
    Lee, Chiapyng
    Zeitschrift fuer Metallkunde/Materials Research and Advanced Techniques, 2008, 99 (11): : 1256 - 1261
  • [8] Effect of minor addition of Pb upon interfacial reactions and mechanical properties at Sn-3.0Ag-0.5Cu/Cu and Sn-58Bi/Cu solder joints
    Yen, Yee-Wen
    Chou, Weng-Ting
    Chen, Hong-Chih
    Liou, Wei-Kai
    Lee, Chiapyng
    INTERNATIONAL JOURNAL OF MATERIALS RESEARCH, 2008, 99 (11) : 1256 - 1261
  • [9] Improvement on interfacial structure and properties of Sn-58Bi/Cu joint using Sn-3.0Ag-0.5Cu solder as barrier
    Wang, Fengjiang
    Li, Dongyang
    Zhang, Zhijie
    Wu, Mingfang
    Yan, Chao
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2017, 28 (24) : 19051 - 19060
  • [10] Effect of Sn-Ag-Cu on the Improvement of Electromigration Behavior in Sn-58Bi Solder Joint
    Fengjiang Wang
    Lili Zhou
    Zhijie Zhang
    Jiheng Wang
    Xiaojing Wang
    Mingfang Wu
    Journal of Electronic Materials, 2017, 46 : 6204 - 6213
12345