Characterization and calibration of blind pixels in short-wave infrared InGaAs focal plane arrays

被引:1
|
作者
Fei, Cheng [1 ,2 ]
Liu, Junliang [2 ]
Li, Tao [3 ]
Huang, Songlei [3 ]
Gu, Yi [3 ,4 ]
Li, Yongfu [1 ]
Dong, Yakui [1 ]
Zhao, Xian [1 ]
Fang, Jiaxiong [1 ,3 ]
机构
[1] Shandong Univ, Ctr Opt Res & Engn, Qingdao, Shandong, Peoples R China
[2] Shandong Univ, Sch Informat Sci & Engn, Qingdao, Shandong, Peoples R China
[3] Chinese Acad Sci, Shanghai Inst Tech Phys, Key Lab Infrared Imaging Mat & Devices, Shanghai, Peoples R China
[4] Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, State Key Lab Funct Mat Informat, Shanghai, Peoples R China
关键词
blind pixel; short-wave infrared InGaAs focal plane arrays; laser beam-induced current; characterization; calibration;
D O I
10.1117/1.OE.58.10.103109
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
Blind pixels are an inevitable problem in short-wave infrared (SWIR) InGaAs focal plane arrays (FPAs). An experiment using a laser beam-induced current method was set up to characterize the blind pixels in InGaAs FPAs. According to the result, the blind pixels are classified into four types: single overhot pixels, single dead pixels, crossing dead pixels, and paired blind pixels. Additionally, the causes of the different types of blind pixels are analyzed. It is indicated that the blind pixels are caused by defects and impurities, disconnection of the readout circuit, unformed PN junctions, and a wrong connection between the PN junction and readout integrated circuit, respectively. Based on the characterization, a blind pixel calibration method that greatly improved the quality of images taken by InGaAs FPAs is proposed. (C) 2019 Society of Photo-Optical Instrumentation Engineers (SPIE)
引用
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页数:7
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