Low-cost plastic sensor packaging using the open-window package concept

被引：16

作者：

Cotofana, C

Bossche, A

Kaldenberg, P

Mollinger, J

机构：

[1] Delft Univ Technol, Elect Instrumentat Lab, Delft Inst Microelect & Submicron Technol, DIMES,Fac Elect Engn, NL-2628 CD Delft, Netherlands

[2] Eurasem BV, NL-6500 AN Nijmegen, Netherlands

来源：

SENSORS AND ACTUATORS A-PHYSICAL | 1998年 / 67卷 / 1-3期

关键词：

plastic packaging; sensor packaging; open window package;

D O I：

10.1016/S0924-4247(97)01767-6

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents a low-cost transfer mould packaging concept for sensors, based on a direct-mould principle. The advantage of this new packaging concept, which we call the open-window package, is that up to the moulding step the whole assembly process is compatible with the standard lead-frame processing, The open-window package concept allows plastic sensor packaging with one or more environmental access paths to be created in a single moulding step. As an application of this new packaging concept, a plastic sensor package with a single access path has: been developed for commercial production. The performances of this new low-cost package are satisfactory and lifetime performances show promising results. Furthermore, packaging of other types of sensors is in preparation. (C) 1998 Elsevier Science S.A. All rights reserved.

引用

页码：185 / 190

页数：6

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