Effect of bonding condition on microstructure and properties of the Si3N4/Si3N4 joint brazed using Cu-Zn-Ti filler alloy

被引:5
|
作者
Zhang, J
Fang, HY
Zhou, Y
Naka, M
机构
[1] Harbin Inst Technol, Sch Mat Sci & Engn, Harbin 150001, Peoples R China
[2] Osaka Univ, Joining & Welding Res Inst, Osaka 5670047, Japan
来源
COMPOSITE MATERIALS III | 2003年 / 249卷
关键词
Si3N4; ceramic; welding; interface; shear strength;
D O I
10.4028/www.scientific.net/KEM.249.255
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Si3N4 ceramic was jointed to itself using a filler alloy of Cu-Zn-Ti at 1123-1323K for 15-45 minutes. Ti content in the Cu-Zn-Ti filler alloy is from 5 at.% to 20 at.%. The effect of brazing parameters, such as brazing temperature, holding time and Ti content, on the mechanical properties and the Si3N4/Si3N4 joint was investigated. The results indicated that with increasing brazing temperature, holding time and Ti content, the thickness of the interfacial reaction layer between the filler alloy and the Si3N4 ceramic increases, meanwhile, the size and amount of the reactant products in the filler alloy also increase, leading to an increasing shear strength of the Si3N4/Si3N4 joint.
引用
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页码:255 / 260
页数:6
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