Reliability of 4H-SiC p-n diodes on LPE grown layers

被引:0
|
作者
Sarov, G
Kakanakov, R
Cholakova, T
Kassamakova, L
Hristeva, N
Lepoeva, G
Philipova, P
Kuznetsov, N
Zekentes, K
机构
[1] Inst Appl Phys, BG-4000 Plovdiv, Bulgaria
[2] AF Ioffe Phys Tech Inst, RU-194021 St Petersburg, Russia
[3] Ctr Crystal Growth, RU-194021 St Petersburg, Russia
[4] Fdn Res & Technol Hellas, GR-71110 Iraklion, Greece
关键词
diode reliability; liquid-phase epitaxy; pn diodes; SiC;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper we present for the first time the results from the long-term testing of power p-n diodes, grown on 4H-SiC substrates by liquid phase epitaxy (LPE). A comparison with 4H-SiC p-n diodes, made on commercially available chemical vapor deposition (CVD) p(+)pn(o)n(+) epitaxial wafers within the same device processing, is given. The increase of the forward voltage drop, DeltaV(F), as a function of the time for LPE and CVD diodes was observed. The striking feature was that the forward degradation in LPE diodes is expressed in less extent than the CVD ones. The observed lower degradation of the LPE diodes is explained by the lower recombination centers density (<10(13) cm(-3)) in LPE layers and consequently of the lower defects propagation when the diodes are subjected to a current load. At the same time, an increase of the specific on-state resistance is observed, which is explained by the presence of thin transition layer.
引用
收藏
页码:929 / 932
页数:4
相关论文
共 50 条
  • [21] 4H-SiC p-i-n diodes grown by sublimation epitaxy in vacuum (SEV) and their application as microwave diodes
    Camara, N.
    Zekentes, K.
    Zelenin, V. V.
    Abramov, P. L.
    Kirillov, A. V.
    Romanov, L. P.
    Boltovets, N. S.
    Krivutsa, V. A.
    Thuaire, A.
    Bano, E.
    Tsoi, E.
    Lebedev, A. A.
    SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 2008, 23 (02)
  • [22] Termination optimization for 4H-SiC p-i-n diodes
    Boianceanu, C.
    Zekentes, K.
    Camara, N.
    Kayambaki, M.
    Rouet, W.
    2006 INTERNATIONAL SEMICONDUCTOR CONFERENCE, VOLS 1 AND 2, 2007, : 327 - +
  • [23] Defect dominant junction characteristics of 4H-SiC p(+)/n diodes
    Scofield, J
    Dunn, M
    Reinhardt, K
    Yeo, YK
    Hengehold, R
    III-NITRIDE, SIC AND DIAMOND MATERIALS FOR ELECTRONIC DEVICES, 1996, 423 : 57 - 62
  • [24] Fabrication of self-aligned graded junction termination extensions with applications to 4H-SiC P-N diodes
    J. N. Merrett
    T. Isaacs-Smith
    D. C. Sheridan
    J. R. Williams
    Journal of Electronic Materials, 2002, 31 : 635 - 639
  • [25] P-n junction periphery protection of 4H-SiC power p-i-n diodes using epitaxy and dry etching
    Sarov, G
    Cholakova, T
    Kakanakov, R
    SILICON CARBIDE AND RELATED MATERIALS 2003, PTS 1 AND 2, 2004, 457-460 : 1005 - 1008
  • [26] Characteristics of trench-refilled 4H-SiC p-n junction diodes fabricated by selective epitaxial growth
    Li, C
    Losee, P
    Seiler, J
    Bhat, I
    Chow, TP
    SILICON CARBIDE AND RELATED MATERIALS 2004, 2005, 483 : 159 - 162
  • [27] Fabrication of self-aligned graded junction termination extensions with applications to 4H-SiC p-n diodes
    Merrett, JN
    Isaacs-Smith, T
    Sheridan, DC
    Williams, JR
    JOURNAL OF ELECTRONIC MATERIALS, 2002, 31 (06) : 635 - 639
  • [28] Application of optical emission microscopy for reliability studies in 4H-SiC p+/n-/n+ diodes
    Galeckas, A
    Linnros, J
    Breitholtz, B
    Bleichner, H
    JOURNAL OF APPLIED PHYSICS, 2001, 90 (02) : 980 - 984
  • [29] Wannier-Stark ladder conditions in 4H-SiC p-n junctions grown on off axis substrates
    Sankin, V. I.
    Shkrebiy, P. P.
    Yakimova, R.
    APPLIED PHYSICS LETTERS, 2006, 89 (23)
  • [30] Observation of a multilayer planar in-grown stacking fault in 4H-SiC p-i-n diodes
    Caldwell, Joshua D.
    Klein, P. B.
    Twigg, Mark E.
    Stahlbush, Robert E.
    Glembocki, Orest J.
    Liu, Kendrick X.
    Hobart, Karl D.
    Kub, Fritz
    APPLIED PHYSICS LETTERS, 2006, 89 (10)