Measuring and understanding cure-dependent viscoelastic properties of epoxy resin: A review

被引:39
|
作者
Mueller-Pabel, Michael [1 ]
Agudo, Jose Alberto Rodriguez [2 ]
Gude, Maik [1 ]
机构
[1] Tech Univ Dresden, Inst Lightweight Engn & Polymer Technol, Holbeinstr 3, D-01307 Dresden, Germany
[2] Anton Paar Germany GmbH, Hellmuth Hirth Str 6, D-73760 Ostfildern Scharnhausen, Germany
关键词
Thermoset; Viscoelasticity; Cure; DMA; Rheology; TEMPERATURE-TRANSFORMATION TTT; DYNAMIC-MECHANICAL ANALYSIS; STRESS-RELAXATION BEHAVIOR; POISSONS RATIO; GLASS-TRANSITION; RHEOLOGICAL CHARACTERIZATION; CROSS-LINKING; BULK MODULUS; FREE-VOLUME; GEL POINT;
D O I
10.1016/j.polymertesting.2022.107701
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The experimental determination of cure-dependent viscoelastic properties is of utmost importance for processing and use of epoxy (EP) resin-based materials and structures. Although this complex topic is frequently addressed in literature and in practice, no standards and few general guidelines for this task are available. Hence, a comprehensive review on rheological experiments and dynamic-mechanical analysis (DMA) including their preparation, conduction and evaluation was conducted. According to the results of our literature research, op-erators are well advised to rely on holistic test protocols that take care of the strong interaction between the curing process, the realistic device capabilities and the viscoelastic phenomena to be measured. We show that erroneous data or misinterpretations may occur if inappropriate measurement setups are employed. Methods for the prevention of both material-and device-related disturbances are suggested. Finally, remaining experimental challenges and future trends in the context of cure-dependent viscoelastic properties of EP are pointed out.
引用
收藏
页数:29
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