共 50 条
- [21] Reliability and Lifetime Estimation of Sintered Silver Die Attach for Different Accelerated Testing Conditions 2022 IEEE 9TH ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, ESTC, 2022, : 480 - 483
- [22] Characterization of Lead-Free Solder and Sintered Nano-Silver Die-Attach Layers Using Thermal Impedance IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2011, 1 (04): : 495 - 501
- [23] INFLUENCE OF PORE SHAPE AND ORIENTATION ON THE THERMAL-CONDUCTIVITY OF POROUS-MEDIA FROM MATERIALS SCIENCE TO CONSTRUCTION MATERIALS ENGINEERING, VOLS 1-3: PORE STRUCTURE AND CONSTRUCTION MATERIALS PROPERTIES, COMBINING MATERIALS, DURABILITY OF CONSTRUCTION MATERIALS, 1987, : 341 - 348
- [26] Reliability of Advanced Thermal Interface Technologies Based on Sintered Die-Attach Materials 2013 19TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS (THERMINIC), 2013, : 281 - +