共 50 条
- [2] Thermal Cycling of Sintered Silver (Ag) Joint as Die-Attach Material JOM, 2019, 71 : 3066 - 3075
- [3] PORE SHAPE AND POROSITY CORRECTION FACTORS FOR THERMAL-CONDUCTIVITY OF SINTERED UO2,01 POWDER METALLURGY INTERNATIONAL, 1980, 12 (03): : 134 - 135
- [6] Thermal Performance and Reliability Assessment of Nano-sintered Silver Die Attach Materials 2015 31ST ANNUAL SEMICONDUCTOR THERMAL MEASUREMENT, MODELING & MANAGEMENT SYMPOSIUM (SEMI-THERM), 2015, : 240 - 247
- [7] The Influence of Mechanical Property on the Heat-Cycle Reliability of Sintered Silver Die Attach PROCEEDINGS OF THE 2020 32ND INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICS (ISPSD 2020), 2020, : 353 - 355
- [8] The Evolutions of Microstructure in Pressureless Sintered Silver Die Attach Material INTERNATIONAL JOURNAL OF NANOELECTRONICS AND MATERIALS, 2021, 14 (02): : 179 - 194
- [9] Effect of Aging and Thermal Shock on the Reliability of Silver Sintered Die Attach for SiC Power Devices Int. Conf. Electron. Packag., ICEP, 2023, (141-142):
- [10] Sintered Silver (Ag) as Lead-free Die Attach Materials 2012 35TH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM (IEMT), 2012,