Thick film solder wells for fine pitch flip chip attach

被引：0
|
作者：
Erickson, M [1 ]
机构：
[1] HEI INC,VICTORIA,MN 55386
来源：
1996 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS | 1996年 / 2920卷
关键词：
solder well; Diffusion Patterning(TM); flip chip; fine pitch; scavenging;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：344 / 348
页数：5
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