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- [48] Modeling of Copper Wire Bonding Ball Transient Temperature Behavior 2009 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2009), 2009, : 345 - +
- [49] Cu low k device wire bonding process modeling ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2007, : 234 - +
- [50] Modeling and Optimization of Mechanical Performance for Cu Wire Bonding Process 2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC, 2023, : 386 - 391