An ESPI system for determining in-plane deformations.: Three-dimensional analysis of the carrier fringes and a proposal for analysis of transient in-plane deformations

被引:9
|
作者
Hurtado-Ramos, JB
Blanco-García, J
Fernández, A
Ribas, F
机构
[1] Univ Vigo, Dept Fis Aplicada, Escuela Ingn Tecn Ind, Vigo 36210, Spain
[2] Univ Vigo, Dept Diseno Ingn, Escuela Ingn Tecn Ind, Vigo 36200, Spain
关键词
in-plane deformation; electronic speckle pattern interferometer; deformation measurements;
D O I
10.1088/0957-0233/12/5/312
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this work we report results on analysis of in-plane deformation using the symmetrical illumination technique. A single illumination source is doubled by means of a mirror placed perpendicular to the object being tested. Carrier fringes are introduced by displacing the symmetrical sources tone of which is virtual), a technique often used in contouring. We present a three-dimensional theoretical model for the generation of the carrier fringes and analyse the basic concepts of this model. Experimental results obtained using a cw laser are also presented. These results and the ones obtained by applying this technique to out-of-plane and shearing systems are the basis for proposing the application of the concept to analysis of in-plane transient deformation using a double cavity Nd:YAG laser. A convenient set-up for that purpose is described.
引用
收藏
页码:644 / 651
页数:8
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