Visualization of Underfill Flow in Ball Grid Array (BGA) using Particle Image Velocimetry (PIV)

被引：0

作者：

Ng, Fei Chong ^{[1
]}

Abas, Aizat ^{[1
]}

Abustan, Ismail ^{[2
]}

Rozainy, Z. Mohd Remy ^{[2
]}

Abdullah, M. Z. ^{[2
]}

Jamaludin, Ali B. ^{[3
]}

Kon, Sharon Melissa ^{[1
]}

机构：

[1] Univ Sains Malaysia, Sch Mech Engn, Engn Campus, Nibong Tebal 14300, Penang, Malaysia

[2] Univ Sains Malaysia, Sch Civil Engn, Engn Campus, Nibong Tebal 14300, Penang, Malaysia

[3] TNB Res Sdn Bhd, Kawasan Inst Penyelidikan, 1 Lorong Ayer Itam, Kajang 43000, Malaysia

来源：

INTERNATIONAL CONFERENCE ON AEROSPACE AND MECHANICAL ENGINEERING (AEROMECH17) | 2018年 / 370卷

关键词：

ENCAPSULATION;

D O I：

10.1088/1757-899X/370/1/012064

中图分类号：

V [航空、航天];

学科分类号：

08 ; 0825 ;

摘要：

This paper presents the experimental methodology using particle image velocimetry (PIV) to study the underfill process of ball grid array (BGA) chip package. PIV is a non-intrusive approach to visualize the flow behavior of underfill across the solder ball array. The BGA model of three different configurations - perimeter, middle empty and full array - were studied in current research. Through PIV experimental works, the underfill velocity distribution and vector fields for each BGA models were successfully obtained. It is found that perimeter has the shortest filling time resulting to a higher underfill velocity. Therefore, it is concluded that the flow behavior of underfill in BGA can be justified thoroughly with the aid of PIV.

引用

页数：6

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