An equipment builder's view on tin plate line design and development

被引:0
|
作者
Hooper, RAE [1 ]
机构
[1] Kvaerner Met, Sheffield, S Yorkshire, England
来源
9TH CONTINUOUS STEEL STRIP PLATING SYMPOSIUM, PROCEEDINGS | 1999年
关键词
D O I
暂无
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
The world market for tinplate and TFS is 15mtpa. Many of the 160 lines built are over 30 years old; recent new lines are mainly in the Pacific Rim. Development trends feature higher quality coatings, increased line speeds and more environmental awareness, with reduced costs. Improved insoluble and soluble anode designs are in use with new electrolytes; FEA studies into fluid flows are leading to improved cell design whilst effluent control is changing to meet tough legislation. These enhancements, together with better machines, such as tension levellers and welders, are being applied to old and new lines to improve quality, reduce costs and increase output.
引用
收藏
页码:129 / 133
页数:5
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