Twin boundary migration and reactions with stacking fault tetrahedron in Cu and CoCrCuFeNi high-entropy alloy

被引:11
|
作者
Fu, Tao [1 ,2 ]
Hu, Hao [1 ]
Hu, Sen [1 ]
Liang, Qihao [1 ]
Weng, Shayuan [1 ,2 ]
Zhao, Yinbo [3 ]
Chen, Xiang [4 ]
Peng, Xianghe [1 ,2 ]
机构
[1] Chongqing Univ, Dept Engn Mech, Chongqing 400044, Peoples R China
[2] Chongqing Univ, State Key Lab Coal Mine Disaster Dynam & Control, Chongqing 400044, Peoples R China
[3] Tohoku Univ, Dept Aerosp Engn, Aoba Ku, 6-6-01 Aramaki Aza Aoba, Sendai, Miyagi 9808579, Japan
[4] Chongqing Univ Posts & Telecommun, Adv Mfg Engn, Chongqing 400065, Peoples R China
基金
中国国家自然科学基金;
关键词
Shear-coupled twin boundary migration; Temperature dependence; Stacking fault tetrahedron; High-entropy alloy; MOLECULAR-DYNAMICS SIMULATION; GRAIN-BOUNDARY; THERMAL-EXPANSION; DEFORMATION; PLASTICITY; EVOLUTION; TRANSFORMATION; COEFFICIENTS; STABILITY; MECHANISM;
D O I
10.1016/j.jmrt.2022.01.006
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
FCC high-entropy alloys (HEAs) have great application potential because of their excellent mechanical properties, in which twin boundary (TB) and stacking fault tetrahedron (SFT) are two kinds of primary defects. In this work, the mechanical responses of a twinned CoCrCuFeNi HEA and twinned Cu counterpart under shear deformation were investigated using molecular dynamics simulations to explore the interactions between TB and SFT and their effects on the mechanical properties of the materials. It was found that the primary carrier of plastic deformation in both twinned CoCrCuFeNi HEA and Cu are shear coupled TB migrations assisted by the glide of partial dislocations. Increasing the size of SFT leads to lower mechanical performances. Moreover, the mechanical properties of the CoCrCuFeNi HEA, including shear modulus and critical shear stress for TB migration, were found to be dependent insignificantly on temperature (100 K-700 K). After the interaction between TB and SFT, a flip-over SFT or SFT-like structure in CoCrCuFeNi HEA, and a rhombic SFT or double-sided SF in Cu are finally formed. (C) 2022 The Author(s). Published by Elsevier B.V.
引用
收藏
页码:282 / 292
页数:11
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