Stress relaxation behavior of lead-free solder joint

被引：0
|
作者：
Zhu, Yongxin [1 ]
Li, Xiaoyan [1 ]
Gao, Ruiting [1 ]
机构：
[1] Beijing Univ Technol, Sch Mat Sci & Engn, Beijing 100024, Peoples R China
来源：
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2015年 / 26卷 / 05期
基金：
中国国家自然科学基金;
关键词：
STRAIN-RATE; SN-AG; PLASTIC-DEFORMATION; FATIGUE DAMAGE; CREEP; TEMPERATURE; EVOLUTION;
D O I：
10.1007/s10854-015-2792-y
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this work, stress relaxation behavior of Sn3.5Ag0.5Cu solder joint was investigated under 398 K. Three strain ranges (4, 6, and 8 %) and two strain rates (0.002 and 0.01/s) were utilized. The results show that the effect of strain range on stress relaxation is not significant under high strain rate. However, it firstly increases with strain range and then decreases after approaching the maximum value under low strain rate. Moreover, Stress relaxes more under high strain rate than that under low strain rate. Feltham equation can describe the stress relaxation behavior well under high strain rate. After a certain relaxation time, crack appears at the corner of the solder joint and the stress appears to increase a little.
引用
收藏
页码：3020 / 3024
页数：5
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