共 50 条
- [41] Hot carrier reliability assessment of vacuum gate dielectric trench MOSFET (TG-VacuFET) EUROPEAN PHYSICAL JOURNAL PLUS, 2022, 137 (04):
- [43] Influence of voids in solder layer on the reliability of the IGBT die attached interconnection under temperature shock 2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2023,
- [44] Hot carrier reliability assessment of vacuum gate dielectric trench MOSFET (TG-VacuFET) The European Physical Journal Plus, 137
- [46] SPECTRUM EMITTED BY PREDISRUPTIVE PHENOMENA IN AIR UNDER ATMOSPHERIC PRESSURE COMPTES RENDUS HEBDOMADAIRES DES SEANCES DE L ACADEMIE DES SCIENCES SERIE B, 1970, 270 (05): : 309 - &
- [47] Reliability Investigation on SiC Trench MOSFET under Repetitive Surge Current Stress of Body Diode 2020 IEEE WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS IN ASIA (WIPDA ASIA), 2020,
- [49] Reliability of Caries Assessment Spectrum and Treatment Tool in the Indian Subcontinent JOURNAL OF INTERNATIONAL SOCIETY OF PREVENTIVE AND COMMUNITY DENTISTRY, 2020, 10 (04): : 410 - 414
- [50] Study on Reliability for Vehicle Skeleton under the Action of Road Spectrum ADVANCES IN MECHANICAL DESIGN, PTS 1 AND 2, 2011, 199-200 : 522 - 525