Integration of high-speed GaAs metal-semiconductor-metal photodetectors by means of transfer printing for 850 nm wavelength photonic interposers

被引:21
|
作者
Chen, Guanyu [1 ,2 ,3 ]
Goyvaerts, Jeroen [3 ]
Kumari, Sulakshna [3 ]
Van Kerrebrouck, Joris [4 ]
Muneeb, Muhammad [3 ]
Uvin, Sarah [3 ]
Yu, Yu [1 ,2 ]
Roelkens, Gunther [3 ]
机构
[1] Huazhong Univ Sci & Technol, Wuhan Natl Lab Optoelect, Wuhan 430074, Hubei, Peoples R China
[2] Huazhong Univ Sci & Technol, Sch Opt & Elect Informat, Wuhan 430074, Hubei, Peoples R China
[3] Univ Ghent, IMEC, Photon Res Grp, Technol Pk 15, B-9052 Ghent, Belgium
[4] Univ Ghent, IMEC, IDLab, Technol Pk 15, B-9052 Ghent, Belgium
来源
OPTICS EXPRESS | 2018年 / 26卷 / 05期
基金
中国国家自然科学基金;
关键词
SILICON; INTERCONNECTS;
D O I
10.1364/OE.26.006351
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
We propose and demonstrate the integration of 850 nm GaAs-based metal-semiconductor-metal (MSM) photodetectors (PDs) based on transfer printing for application in photonic interposers. Both devices that directly interface with a multimode optical fiber (with device dimensions of 70 mu m x 70 mu m) as well as devices that interface with a SiN waveguide layer through a grating coupler (with device dimensions of 30 mu m x 30 mu m) are demonstrated. The dark currents are measured to be 22 nA and 7.2 nA at 2 V bias for the larger and smaller PDs respectively. For 850 nm wavelength, the external responsivities are measured to be 0.117 A/W and 0.1 A/W at 2 V bias. 20 GHz bandwidth is measured. Open 40 Gb/s eye diagrams are realized. (C) 2018 Optical Society of America
引用
收藏
页码:6351 / 6359
页数:9
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