Directional Solidification Structure and Deformation Behavior of Silver Bonding Wire

被引：0

作者：

Kang, Feifei ^{[1
]}

Zhou, Wenyan ^{[2
]}

Kong, Jianwen ^{[1
]}

Wu, Yongjin ^{[1
]}

Pei, Hongying ^{[1
]}

Zhang, Kunhua ^{[3
]}

机构：

[1] Sinoplatinum Met Co Ltd, Semicond Mat Div, Kunming, Yunnan, Peoples R China

[2] Kunming Inst Precious Met, R&D Ctr, Kunming, Yunnan, Peoples R China

[3] Kunming Inst Precious Met, Informat Ctr, Kunming, Yunnan, Peoples R China

来源：

2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2018年

基金：

中国博士后科学基金;

关键词：

semiconductor package; silver bonding wire; microalloy; directional solidification technique; deformation behavior; GOLD; FUTURE;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The silver bonding wire of Phi 0.018mm was fabricated by directional solidification technique and severe plastic drawing technology. The effect of micro-alloying on directional solidification structure and deformation behavior of silver bonding wire was analyzed. The correlation among micro-alloying, directional solidification structure and deformation behavior was described. The results show that micro-alloying elements influence grain growth direction, restrict the grain growth, and then form ingot with special morphology, such as dendritic crystal, columnar crystal and lamellar structure and so on. Silver bonding wire with grains distributed along the wire radial direction and containing a large number of twins in the crystal grains have good plasticity and toughness in severe plastic drawing process. The yield can reach up to 65%, and the length of a single wire can reach 24000 meters. The silver bonding wire with dendritic morphology has a high breaking rate, and the fracture mechanism is transgranular cleavage fracture.

引用

页码：722 / 727

页数：6

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