Research on Reliability Quantitative Evaluation Method of Stepping Stress Strengthening Test for Electronic Equipment

Reliability testing has been widely used in product design and development process. Among them, because multiple stress level conditions exist in the stepping stress strengthening test, the reliability quantitative assessment of the stepping stress strengthening test has become a difficult point. This paper focuses on the research on the data analysis method of stepping stress strengthening test, and proposes a reliability quantitative assessment technical framework towards the stepping stress strengthening test method. Bayesian estimation, MCMC principle and Gibbs sampling method are used to obtain the reliability characteristics of the product in the stepping stress strengthening test. The proposed method has been applied to the results of typical low-temperature stepping stress strengthening test, which verifies the effectiveness and practicability of the method.