Diffusion mechanism and kinetics of diffusion bonded Mg/Ni/Al joint

被引：1
|
作者：
Zhang, Jian [1 ,2 ]
Luo, Guoqiang [1 ]
Shen, Qiang [1 ]
Zhang, Lianmeng [1 ]
机构：
[1] Wuhan Univ Technol, State Key Lab Adv Technol Mat Synth & Proc, Wuhan 430070, Peoples R China
[2] Wuhan Iron & Steel Grp Corp, Ctr Res & Dev, Wuhan, Peoples R China
来源：
ADVANCED CERAMICS AND NOVEL PROCESSING | 2014年 / 616卷
关键词：
diffusion bonding; diffusion kinetics; interface; Mg/Ni/Al joint; DISSIMILAR METALS; AL; MG; MICROSTRUCTURE; INTERLAYER; MAGNESIUM; FILM;
D O I：
10.4028/www.scientific.net/KEM.616.286
中图分类号：
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
Mg and Al were bonded successfully by means of diffusion bonding using Ni interlayer. The microstructure, diffusion mechanism and regulation of atom diffusion were investigated by means of scanning electron microscopy (SEM), X-ray diffraction (XRD) and electron probe microanalysis analysis (EPMA). The results showed that the joints consisted of Mg-Ni interface and Al-Ni interface, and there were Mg2Ni formed in the Mg-Ni interface and Al3Ni formed in the Al-Ni interface, respectively. Diffusion activation energy of Mg and Al were lower than that of Ni in the Mg-Ni and Al-Ni interface. The thickness (x) of Mg2Ni and Al3Ni can be expressed as x(2) = 3.97x10(-4) exp (-139600/RT) (t-t(0)) and x(2) = 8.62x10(-3) exp (-174200/RT) (t-t(0)) with heating temperature (T) and holding time (t).
引用
收藏
页码：286 / 290
页数：5
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