THE ADVANCED MEMS (aMEMS) PROCESS FOR FABRICATING WAFER LEVEL VACUUM PACKAGED SOI-MEMS DEVICES WITH EMBEDDED VERTICAL FEEDTHROUGHS

被引：0

作者：

Torunbalci, M. M. ^{[1
]}

Alper, S. E. ^{[1
]}

Akin, T. ^{[1
,2
]}

机构：

[1] Middle East Tech Univ, MEMS Res & Applicat Ctr, Ankara, Turkey

[2] Middle East Tech Univ, Dept Elect & Elect Engn, Ankara, Turkey

来源：

2015 TRANSDUCERS - 2015 18TH INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS, ACTUATORS AND MICROSYSTEMS (TRANSDUCERS) | 2015年

关键词：

Advanced MEMS (aMEMS) process; wafer level hermetic encapsulation; vertical feedthroughs; anodic bonding;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents a novel, inherently simple and low-cost fabrication and hermetic packaging method developed for SOI-MEMS devices, where an SOI wafer is used for the fabrication of MEMS structures as well as vertical feedthroughs, while a glass cap wafer is used for hermetic encapsulation and routing metallization. Glass-to-silicon anodically bonded seals yield a very stable cavity pressure of 150 mTorr after 15 days. The shear strength of the fabricated packages is above 7 MPa. Temperature cycling and ultra-high temperature shock tests results in no degradation in the hermeticity of the packaged chips.

引用

页码：472 / 475

页数：4

共 43 条

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