THE ADVANCED MEMS (aMEMS) PROCESS FOR FABRICATING WAFER LEVEL VACUUM PACKAGED SOI-MEMS DEVICES WITH EMBEDDED VERTICAL FEEDTHROUGHS

被引：0
|
作者：
Torunbalci, M. M. [1 ]
Alper, S. E. [1 ]
Akin, T. [1 ,2 ]
机构：
[1] Middle East Tech Univ, MEMS Res & Applicat Ctr, Ankara, Turkey
[2] Middle East Tech Univ, Dept Elect & Elect Engn, Ankara, Turkey
来源：
2015 TRANSDUCERS - 2015 18TH INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS, ACTUATORS AND MICROSYSTEMS (TRANSDUCERS) | 2015年
关键词：
Advanced MEMS (aMEMS) process; wafer level hermetic encapsulation; vertical feedthroughs; anodic bonding;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper presents a novel, inherently simple and low-cost fabrication and hermetic packaging method developed for SOI-MEMS devices, where an SOI wafer is used for the fabrication of MEMS structures as well as vertical feedthroughs, while a glass cap wafer is used for hermetic encapsulation and routing metallization. Glass-to-silicon anodically bonded seals yield a very stable cavity pressure of 150 mTorr after 15 days. The shear strength of the fabricated packages is above 7 MPa. Temperature cycling and ultra-high temperature shock tests results in no degradation in the hermeticity of the packaged chips.
引用
收藏
页码：472 / 475
页数：4
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