Low Cost Si-less RDL Interposer Package for High Performance Computing Applications

被引:31
|
作者
Suk, Kyoung-Lim [1 ]
Lee, Seok Hyun [1 ]
Kim, Jong Youn [1 ]
Lee, Seok Won [1 ]
Kim, Hak Jin [1 ]
Lee, Su Chang [1 ]
Kim, Pyung Wan [1 ]
Kim, Dae-Woo [1 ]
Oh, Dan [1 ]
Byun, Jung Soo [2 ]
机构
[1] Samsung Elect Co Ltd, Package Dev Team, Suwon, Gyeonggi Do, South Korea
[2] Samsung Electromech Co Ltd, PLP Dev Team, Suwon, Gyeonggi Do, South Korea
来源
2018 IEEE 68TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2018) | 2018年
关键词
component; redistribution layer (RDL); Si interposer; Si-less RDL interposer; server; high performance computing (HPC);
D O I
10.1109/ECTC.2018.00018
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A new concept of Si-less redistribution layer (RDL) platform was proposed for server/HPC applications with advantage of packaging cost reduction, warpage control, and enhanced reliability. In this paper, RDL interposer package with size larger than 3000mm(2) was fabricated. Warpage behavior, electrical performance and reliability of the RDL interposer package were evaluated. In order to predict warpage behavior of RDL interposer, the critical factors were defined. The electrical performance between Si interposer and RDL interposer was analyzed using electrical simulation and finally joint reliability was also compared in terms of predicted joint stress.
引用
收藏
页码:64 / 69
页数:6
相关论文
共 50 条
  • [41] High performance computing in biomedical applications
    Bastrakov, S.
    Meyerov, I.
    Gergel, V.
    Gonoskov, A.
    Gorshkov, A.
    Efimenko, E.
    Ivanchenko, M.
    Kirillin, M.
    Malova, A.
    Osipov, G.
    Petrov, V.
    Surmin, I.
    Vildemanov, A.
    2013 INTERNATIONAL CONFERENCE ON COMPUTATIONAL SCIENCE, 2013, 18 : 10 - 19
  • [42] High performance computing in petroleum applications
    Ewing, Richard E.
    Qin, Guan
    Zhao, Wei
    INTERNATIONAL JOURNAL OF NUMERICAL ANALYSIS AND MODELING, 2005, 2 : 43 - 57
  • [43] High performance computing applications - Appendix A
    不详
    INTERNATIONAL JOURNAL OF HIGH PERFORMANCE COMPUTING APPLICATIONS, 2001, 15 (02): : 191 - 194
  • [44] Signal Integrity Analysis on High-Density Silicon Interposer Package Technology for Next Generation Applications
    Singh, Surender
    Gupta, Ashish
    2018 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM (EDAPS 2018), 2018,
  • [45] Electrical design of a low cost and high performance plastic ball grid array package - NuBGA
    Chou, TY
    Wu, F
    Lau, J
    Chen, KL
    47TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 1997 PROCEEDINGS, 1997, : 1081 - 1086
  • [46] FINLESS heat sinks, high performance and low cost for low profile cooling applications
    Walsh, Ed
    Grimes, Ronan
    Walsh, Patrick
    Stafford, Jason
    PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2011, VOL 10, PTS A AND B, 2012, : 1 - 9
  • [47] Finless Heat Sinks, High Performance and Low Cost for Low Profile Cooling Applications
    Walsh, Ed
    Grimes, Ronan
    Walsh, Patrick
    Stafford, Jason
    JOURNAL OF THERMAL SCIENCE AND ENGINEERING APPLICATIONS, 2013, 5 (03)
  • [48] Design and Demonstration of Low Cost, Panel-based Polycrystalline Silicon Interposer with Through-Package-Vias (TPVs)
    Chen, Qiao
    Bandyopadhyay, Tapobrata
    Suzuki, Yuya
    Liu, Fuhan
    Sundaram, Venky
    Pucha, Raghuram
    Swaminathan, Madhavan
    Tummala, Rao
    2011 IEEE 61ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2011, : 855 - 860
  • [49] A novel low-cost pluggable chip scale package for high pin-count applications
    Crane, SW
    Jeon, J
    Ogata, C
    Wang, T
    Cangellaris, A
    Schutt-Aine, J
    51ST ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2001, : 69 - 73
  • [50] A novel low-cost pluggable chip scale package for high-pin-count applications
    Crane, SW
    Jeon, J
    Ogata, C
    Wang, T
    Cangellaris, A
    Schutt-Aine, J
    2001 HD INTERNATIONAL CONFERENCE ON HIGH-DENSITY INTERCONNECT AND SYSTEMS PACKAGING, PROCEEDINGS, 2001, 4428 : 292 - 296