Low Cost Si-less RDL Interposer Package for High Performance Computing Applications

被引：31
|
作者：
Suk, Kyoung-Lim [1 ]
Lee, Seok Hyun [1 ]
Kim, Jong Youn [1 ]
Lee, Seok Won [1 ]
Kim, Hak Jin [1 ]
Lee, Su Chang [1 ]
Kim, Pyung Wan [1 ]
Kim, Dae-Woo [1 ]
Oh, Dan [1 ]
Byun, Jung Soo [2 ]
机构：
[1] Samsung Elect Co Ltd, Package Dev Team, Suwon, Gyeonggi Do, South Korea
[2] Samsung Electromech Co Ltd, PLP Dev Team, Suwon, Gyeonggi Do, South Korea
来源：
2018 IEEE 68TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2018) | 2018年
关键词：
component; redistribution layer (RDL); Si interposer; Si-less RDL interposer; server; high performance computing (HPC);
D O I：
10.1109/ECTC.2018.00018
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A new concept of Si-less redistribution layer (RDL) platform was proposed for server/HPC applications with advantage of packaging cost reduction, warpage control, and enhanced reliability. In this paper, RDL interposer package with size larger than 3000mm(2) was fabricated. Warpage behavior, electrical performance and reliability of the RDL interposer package were evaluated. In order to predict warpage behavior of RDL interposer, the critical factors were defined. The electrical performance between Si interposer and RDL interposer was analyzed using electrical simulation and finally joint reliability was also compared in terms of predicted joint stress.
引用
收藏
页码：64 / 69
页数：6
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