New manufacturing method for capacitive ultrasonic transducers with monocrystalline membrane

被引：0
|
作者：
Rey, Patrice [1 ]
Salhi, M. [1 ]
Giroud, S. [1 ]
Robert, P. [1 ]
Lagahe-Blanchard, C. [2 ]
Clatot, S. [3 ]
Ballandras, S. [3 ]
机构：
[1] CEA LETI, 17 Rue Martyrs, F-38054 Grenoble 09, France
[2] TRACIT Technol, F-38054 Grenoble 09, France
[3] FEMTO ST, CNRS, Dept LPMO, UMR 6174, F-25044 Besancon, France
来源：
PROCEEDINGS OF THE IEEE TWENTIETH ANNUAL INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, VOLS 1 AND 2 | 2007年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A new method to manufacture Capacitive Micromachined Ultrasonic Transducers (cMUT) combining a wafer bonding and a sacrificial layer processes is introduced. Devices with monocrystalline silicon membranes over a polysilicon electrode have been manufactured. The process is highly reliable and shows an excellent homogeneity all over the 200mm wafer. From impedance measurements in air of a monocell test device biased under 140V, a resonance at 8.0MHz and an electromechanical coupling coefficient of 45% have been found. Underwater pulse-echo experiments are presented demonstrating a large bandwith of the device of about 130%.
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页码：111 / +
页数：2
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