LTCC technology for high performance low power base station applications

被引：0

作者：

Passiopoulos, G ^{[1
]}

机构：

[1] Nokia UK Ltd, Camberley GU15 3BW, England

来源：

CERAMIC INTERCONNECT TECHNOLOGY: NEXT GENERATION | 2003年 / 5231卷

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Low Temperature Cofired Ceramic technology (LTCC) has been perceived to be an enabling RF passives integration and module packaging technology that can bring size, performance and cost benefits for a wide range of RF functions ranging from component to system level and across a wide range of Wireless applications. In this paper we address the utilization of this technology as applied to the needs of Low to Medium Power, RF Components and Subsystems aimed for High performance Base Station applications. Recent LTCC component level examples for such applications will be presented and their suitability will be argued. Examples presented will include high performance signal processing integrated passive components as well as RF system building blocks as these are enabled by using such a technology. The current challenges and range of opportunities using LTCC technology for High Performance Base Station applications will be addressed.

引用

页码：85 / 90

页数：6

共 50 条

[1] High power LDMOS for cellular base station applications
Shindo, M
Morikawa, M
Fujioka, T
Nagura, K
Kurotani, K
Odaira, K
Uchiyama, T
Yoshida, I
ISPSD'01: PROCEEDINGS OF THE 13TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES & ICS, 2001, : 107 - 110
[2] Mob power, high efficiency, AlGaN/GaN HEMT technology for wireless base station applications
Vetury, R
Wei, Y
Green, SR
Mercier, TW
Leverich, K
Garber, PM
Poulton, MJ
Shealy, JB
2005 IEEE MTT-S International Microwave Symposium, Vols 1-4, 2005, : 487 - 490
[3] High power GaN-HEMT for wireless base station applications
Kikkawa, Toshihide
Joshin, Kazukiyi
IEICE TRANSACTIONS ON ELECTRONICS, 2006, E89C (05): : 608 - 615
[4] Design Considerations for High Power BAW Duplexers for Base Station Applications
Galipeau, J.
Chang, R. E.
2015 IEEE INTERNATIONAL ULTRASONICS SYMPOSIUM (IUS), 2015,
[5] Research on Performance of Power Saving Technology for 5G Base Station
Zhang, Hua
Guo, Han
Xie, Weiliang
IWCMC 2021: 2021 17TH INTERNATIONAL WIRELESS COMMUNICATIONS & MOBILE COMPUTING CONFERENCE (IWCMC), 2021, : 194 - 198
[6] 10nm FINFET Technology for Low Power and High Performance Applications
Guo, D.
Shang, H.
Seo, K.
Haran, B.
Standaert, T.
Gupta, D.
Alptekin, E.
Bae, D.
Bae, G.
Chanemougame, D.
Cheng, K.
Cho, J.
Hamieh, B.
Hong, J.
Hook, T.
Jung, J.
Kambhampati, R.
Kim, B.
Kim, H.
Kim, K.
Kim, T.
Liu, D.
Mallela, H.
Montanini, P.
Mottura, M.
Nam, S.
Ok, L.
Park, Y.
Paul, A.
Prindle, C.
Ramachandran, R.
Sardesai, V.
Scholze, A.
Seo, S.
Southwick, R.
Strane, J.
Sun, X.
Tsutsui, G.
Tripathi, N.
Vega, R.
Weybright, M.
Xie, R.
Yeh, C.
Bu, H.
Burns, S.
Canaperi, D.
Celik, M.
Colburn, M.
Jagannathan, H.
Kanakasabaphthy, S.
2014 12TH IEEE INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT), 2014,
[7] LTCC for high-power RF applications?
Spectrian Inc., 350 W. Java Drive, Sunnyvale, CA 94089, United States
Adv Packag, 9 (46-50):
[8] Low profile integratable inductor fabricated based on LTCC technology for microprocessor power delivery applications
Lim, MHF
Liang, Z
van Wyk, JD
APEC 2006: TWENTY-FIRST ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION, VOLS 1-3, 2006, : 593 - 599
[9] A 70W High Efficiency Power Amplifier for Base Station Applications
Alon, M.
Singer, S.
2019 IEEE INTERNATIONAL CONFERENCE ON MICROWAVES, ANTENNAS, COMMUNICATIONS AND ELECTRONIC SYSTEMS (COMCAS), 2019,
[10] Low profile integratable inductor fabricated based on LTCC technology for microprocessor power delivery applications
Lim, Michele Hui Fem
Liang, Zhenxian
van Wyk, Jacobus Daniel
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2007, 30 (01): : 170 - 177

← 1 2 3 4 5 →