Indentation Load-Displacement Relations for the Spherical Indentation of Elastic Film/Substrate Structures

被引：0
|
作者：
Kurapati, S. N. V. R. K. [1 ]
Lu, Y. C. [1 ]
Yang, F. [2 ]
机构：
[1] Univ Kentucky, Dept Mech Engn, Lexington, KY 40506 USA
[2] Univ Kentucky, Dept Chem & Mat Engn, Lexington, KY USA
来源：
CMC-COMPUTERS MATERIALS & CONTINUA | 2010年 / 20卷 / 01期
基金：
美国国家科学基金会;
关键词：
Nanoindentation; thin film; finite element method; FINITE-ELEMENT-ANALYSIS; THIN-FILMS; AXISYMMETRICAL INDENTATION; MECHANICAL-PROPERTIES; COATED SYSTEMS; NANOINDENTATION; SUBSTRATE; BEHAVIOR; HARDNESS; CONTACT;
D O I：
暂无
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
The spherical indentation of elastic film /substrate structures is analyzed using the finite element method. The load-displacement curves of the film /substrate structures of various configurations are obtained and analyzed. A generalized power law relation is established, which can be used to analyze the load-displacement curve of elastic film /substrate systems under spherical indentations. The indentation load is dependent on the modulus ratio of the film to the substrate and film thickness. A semi-analytical expression for the power of the power law relation is also obtained as a function of the normalized film thickness and normalized film modulus, which can be used to determine the modulus of the film from a spherical indentation test.
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页码：1 / 17
页数：17
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